Download Characterization of Integrated Circuit Packaging Materials by Thomas Moore PDF

By Thomas Moore

With a selected emphasis on fabrication quality controls, this quantity within the fabrics Characterization sequence specializes in characterization options used for severe junctures in package deal layout like mould compound adhesion and power, mechanical rigidity, moisture sensitivity, solderability of IC elements, and interconnect structures. Readers will locate: -- basic evaluate of IC package deal reliability trying out -- Characterization for functionality of IC programs -- realizing floor features and interfaces for thermal administration -- Concise summaries of significant characterization applied sciences for built-in circuit packaging fabrics, together with acoustic microscopy, atomic absorption spectrometry, Auger Electron Spectroscopy, Energy-Dispersive X-Ray Spectroscopy, and plenty of more.

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